This is accomplished by connecting all of the design's registers in serial fashion, allowing test engineers to shift data in and out through a few ports at the chip level (Fig. 1). That allows, for ...

Memory test at-speed isn't easy but can be achieved by balancing test selection, area overhead, and test-time constraints. The semiconductor industry has intensified its focus on yield issues to meet ...

With Design-For-Test (DFT), test coverage is the typical yardstick used to gauge the quality of the manufacturing tests being performed. But as next-generation designs become more complex, traditional ...

New manufacturing test challenges are raised with SoC technology advances where both test quality and test costs are affected with a direct impact on current Design-For-Test (DFT) methodologies and ...

In today’s highly competitive semiconductor industry, chip-design companies strive for competitive advantages by optimizing designs for PPA (Power, Performance, Area). Along with the functional logic, ...

The testing and verification of semiconductor chips was a prominent topic at this year’s European Test Systems (ETS) conference, especially in the area of Design-for-Test (DFT) tools and techniques.

Until very recently, semiconductor design, verification, and test were separate domains. Those domains have since begun to merge, driven by rising demand for reliability, shorter market windows, and ...

Join us on Wednesday, December 15 at noon Pacific for the Design for Test Hack Chat with Duncan Lowder! If your project is at the breadboard phase, or even if you’ve moved to a PCB prototype, it’s ...